（SMD3225晶振8MHz产品图）

SMD3225晶振8MHz规格书及使用说明

标称频率 Nominal Frequency:8.000MHz
盒型 Holder Type: SMD 3.2*2.5
振动模式 Vibration Mode: Fundamental（基频）
调整频差 Frequency Tolerance（+25℃）:±10 ppm
温度频差 Frequency Drift（-20 to +70℃ ）: ±30 ppm
工作温度范围 Operating Temperature Range: -40 to +85℃
仓储温度范围 Storage Temperature Range: -55 to +125℃
等效电阻 Equivalent Resistance: 300 ohms.
静电容 Shunt Capacitance（C0）:7pF Maximum
负载电容 Load Capacitance: 20pF
激励功率 Drive Level:10 μw Typical
振动试验 Vibration Test:10 to 55 Hz（1.5mmp-p,lhr）
年老化率 Aging Rate a year:≤±3 ppm
跌落试验 Drop Test :从100cm高度跌落到30mm厚硬质木板上3次(3 drops from 100 cm height to 30mm-thick hard wooden board)
检测仪器 Test Impedance Meter: 350D测试系统

SMD3225晶振8MHz外形尺寸图(MARKING AND DIMENSIONS)

SMD3225晶振8MHz回流焊作业建议(Recommended Reflow soldering condition (SMD))

Solder profile

Peak: 245±5℃ Soldering zone: 230℃ or more, 30±10s. Pre-heating zone 1: 150～180℃, 90±30s

Temperature profile for reflow soldering

Soldering iron method

Bit temperature:350±10℃ Application time of soldering iron:3+1 s. For other

procedures, refer to IEC 60068-2-20.